As storage demands skyrocket in mobile devices, Universal Flash Storage (UFS) has become the industry standard, leaving eMMC in the dust. But what makes UFS 3.1 tick? It’s all about the lanes.
| Pin | Symbol | Function | Active Level | Pull-up/Pull-down | | :--- | :--- | :--- | :--- | :--- | | L1, L2 | | Hardware Reset. Resets the UFS controller and UniPro layer. | Low (active low) – Must be held low >1ms | 10kΩ pull-up to VCCQ | | R3 | REF_CLK_REQ | Clock Request. Device asserts high to request host enable REF_CLK for low-power exit. | High | Internal pull-down | | T1 | CORE_EN / PWR_EN | Power Enable. Enables internal voltage regulators. Usually tied to host GPIO. | High | Pull-down | | N/A (on some packages) | BOOT_LD | Boot Ladder Enable. Pin-strapping option to force boot from ROM. | High | Pull-down | ufs 3.1 pinout
The power supply for the UFS controller and low-voltage logic circuits. It typically runs at 1.2V . As storage demands skyrocket in mobile devices, Universal
UFS 3.1 typically utilizes a (153-ball) package with an 11.5mm x 13.0mm footprint. Unlike the parallel interface of eMMC, UFS uses a serial differential interface (MIPI M-PHY) to achieve significantly higher speeds—over 1,500 MB/s for UFS 3.1. ⚡ Critical Signal Groups | Pin | Symbol | Function | Active
UFS 3.1 is a high-speed storage interface designed for mobile devices, laptops, and other applications that require fast storage access. It is a successor to the UFS 3.0 interface and offers several improvements, including higher speeds, lower power consumption, and improved reliability. UFS 3.1 supports speeds of up to 23.2 Gbps (gigabits per second), which is significantly faster than its predecessor, UFS 3.0, which supports speeds of up to 17.6 Gbps.
The old solder leads must be cleaned and replaced with fresh solder spheres using a dedicated BGA 153 or BGA 254 stencil.